XPG SX8200 960 GB M.2 PCI Express 3.0 NVMe 3D TLC
- Capacity
- 960 GB
- Form factor
- M.2
- Read speed
- 3150 MB/s
- Write speed
- 1700 MB/s
- Interface
- PCI Express 3.0
- NAND type
- 3D TLC
- ECC support
- Y
- NVMe
- Y
- Depth
- 22 mm
Overview
The XPG SX8200 960 GB M.2 PCI Express 3.0 NVMe 3D TLC features a 960 GB SSD, Heatsink cooling and NVMe support. Full verified specifications are listed below.
Compatibility
- Requires 3D TLC memory — not interchangeable with other generations.
Compatibility data is automatically generated. Always verify critical specs before purchase.
Technical Specifications
Showing 28 key specifications of 37
All values come from this product’s catalog record.- Capacity
- 960 GB
- Form factor
- M.2
- Read speed
- 3150 MB/s
- Write speed
- 1700 MB/s
- Interface
- PCI Express 3.0
- NAND type
- 3D TLC
- ECC support
- Yes
- NVMe
- Yes
- Depth
- 22 mm
- Width
- 80 mm
- Height
- 3.5 mm
- Weight
- 8 g
- Cooling type
- Heatsink
- NVMe version
- 1.3
- RAID support
- Yes
- Intended use
- PC/Notebook
- Colour
- Black
- Operating shock resistance
- 1500
- Random read (4KB)
- 310000
- Random write (4KB)
- 280000
- Compliance certificates
- RoHS
- Power draw (reading)
- 0.33 W
- Power draw (writing)
- 0.33 W
- Storage temperature
- -40 - 85
- Brand specific technologies
- SLC Caching
- Operating temperature
- 0 - 70
- Sequential read speed (CDM)
- 3150
- Sequential read speed (ATTO)
- 3050
Show all 37 specifications
- Certifications
- CE, FCC, BSMI, VCCI, KC
- Sequential write speed (CDM)
- 1700
- Sequential write speed (ATTO)
- 1700
- Sequential read speed (AS SSD)
- 2500
- Low-density parity-check (LDPC)
- Yes
- Sequential write speed (AS SSD)
- 1600
- PCI Express interface data lanes
- x4
- MTBF
- 2000000
- Operating humidity
- 5 - 95
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Product lifecycle
Status uncertainAvailable catalog signals are incomplete, so current lifecycle status cannot be confirmed.
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