MPN:
ASX8200NP-960GT-C
XPG SX8200 960 GB M.2 PCI Express 3.0 NVMe 3D TLC
- Capacity
- 960 GB
- Form factor
- M.2
- Read speed
- 3150 MB/s
- Write speed
- 1700 MB/s
- Interface
- PCI Express 3.0
- NAND type
- 3D TLC
- ECC support
- Y
- NVMe
- Y
- Depth
- 22 mm
Overview
The XPG SX8200 960 GB M.2 PCI Express 3.0 NVMe 3D TLC features a 960 GB SSD, Heatsink cooling and NVMe support. Full verified specifications are listed below.
Compatibility
- Requires 3D TLC memory — not interchangeable with other generations.
Compatibility data is automatically generated. Always verify critical specs before purchase.
Technical Specifications
Memory
1- ECC support
- Yes
General
24- NVMe
- Yes
- NVMe version
- 1.3
- RAID support
- Yes
- Certifications
- CE, FCC, BSMI, VCCI, KC
- Intended use
- PC/Notebook
- Operating shock resistance
- 1500
- Random read (4KB)
- 310000
- Random write (4KB)
- 280000
- Compliance certificates
- RoHS
- Power draw (reading)
- 0.33 W
- Power draw (writing)
- 0.33 W
- Storage temperature
- -40 - 85
- Brand specific technologies
- SLC Caching
- Operating temperature
- 0 - 70
- Sequential read speed (CDM)
- 3150
- Sequential read speed (ATTO)
- 3050
- Sequential write speed (CDM)
- 1700
- Sequential write speed (ATTO)
- 1700
- Sequential read speed (AS SSD)
- 2500
- Low-density parity-check (LDPC)
- Yes
- Sequential write speed (AS SSD)
- 1600
- PCI Express interface data lanes
- x4
- MTBF
- 2000000
- Operating humidity
- 5 - 95
Physical
5- Depth
- 22 mm
- Width
- 80 mm
- Height
- 3.5 mm
- Weight
- 8 g
- Colour
- Black
Ports & Connectivity
1- Interface
- PCI Express 3.0
Storage
5- Read speed
- 3150 MB/s
- NAND type
- 3D TLC
- Write speed
- 1700 MB/s
- Capacity
- 960 GB
- Form factor
- M.2
Cooling
1- Cooling type
- Heatsink
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Product lifecycle
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