Intel OEM: HP MPN: KK666ET

Intel Core Z200 Intel® Core™ i3 i3-540 2 GB DDR3-SDRAM Windows 7 Professional Minitower Workstation

Desktops
Released: Oct 22, 2010 16 years ago
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ECC support
Y
Depth
454.3 mm
Max case temperature (Tcase)
72.6 °C
Width
177.8 mm
Height
447.6 mm
Weight
10700 g
Bus type
DMI
64-bit support
Y
Stepping
C2
View 109 specifications
1 / 3
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Overview

The HP Z200 Intel® Core™ i3 i3-540 2 GB DDR3-SDRAM Windows 7 Professional Minitower Workstation features Intel Core i3 processor, 2 cores, 2 GB of memory and DDR3-SDRAM. Full verified specifications are listed below.

Compatibility

Socket LGA 1156 (Socket H) Memory type DDR3 Interface PCIe 2.0 TDP 73 W PSU wattage 320 W
  • Pairs with CPUs using the LGA 1156 (Socket H) socket.
  • Requires DDR3 memory — not interchangeable with other generations.
  • Draws up to 73 W — size your cooling and PSU headroom accordingly.

Compatibility data is automatically generated. Always verify critical specs before purchase.

Technical Specifications

Showing 28 key specifications of 109

All values come from this product’s catalog record.
ECC support
Yes
Depth
454.3 mm
Max case temperature (Tcase)
72.6 °C
Width
177.8 mm
Height
447.6 mm
Weight
10700 g
Bus type
DMI
64-bit support
Yes
Stepping
C2
Spindle speed
7200 rpm
FSB Parity
No
Idle power states
Yes
LightScribe
Yes
RAID levels
0,1,5
Chassis type
Minitower
Capacity
160 GB
Power supply
320
Product type
Workstation
RAID support
Yes
Drive interface
SATA
Microphone input
Yes
Capacity
2 GB
Memory channels
Dual-channel
Cache
4 MB
Cores
2
Model
i3-540
Size (imperial)
17.9
Bus speed
2.5 GT/s
Show all 109 specifications
Audio system
High Definition Audio
Display included
No
Intel ARK ID
46473
Processor line
Intel Core i3
Processor series
Intel Core i3-500 Desktop series
Socket
LGA 1156 (Socket H)
Headphone outputs
1
Threads
4
Intel® Insider™
No
Memory clock
1333 MHz
Optical drive type
DVD Super Multi
Codename
Clarkdale
Execute Disable (NX)
Yes
Networking features
Gigabit Ethernet (10/100/1000)
PS/2 ports
2
Die size
81 mm²
Clock speed
3.06 GHz
Total HDDs capacity
160
DVI-I ports quantity
1
Intel FDI Technology
Yes
Memory type
DDR3-SDRAM
Cache level
Smart Cache
Generation
Intel Core i3-xxx
DisplayPorts quantity
1
Process node
32 nm
Card reader
Yes
Integrated graphics
Yes
CPU brand
Intel
Processor package size
37.5 x 37.5
USB 2.0 ports
8
CPU configuration (max)
1
Conflict-free minerals
No
Max memory
16 GB
Intel Fast Memory Access
No
Intel Flex Memory Access
No
Number of HDDs installed
1
Intel Enhanced Halt State
Yes
PCI Express slots version
2.0
CPU operating modes
64-bit
ECC memory support
No
Long-term availability
Yes
Ethernet ports
1
Graphics & IMC lithography
45
Operating system
Windows 7 Professional
PCI Express configurations
1x16,2x8
Instruction sets
SSE4.2
TDP
73 W
Intel Clear Video Technology
No
Intel Demand Based Switching
No
Integrated GPU model
Intel HD Graphics
On-board graphics card family
Intel HD Graphics
Intel Rapid Storage Technology
No
Intel® InTru™ 3D Technology
No
Intel® Turbo Boost Technology
No
Number of processors installed
1
CPU multiplier (bus/core ratio)
23
Thermal monitoring
No
Physical Address Extension (PAE)
36
Trusted Execution (TXT)
No
SpeedStep power scaling
Yes
Intel® Quick Sync Video Technology
No
PCIe lanes
16
Memory types supported by processor
DDR3 1066/1333
Transistor count
382
Intel Dual Display Capable Technology
Yes
On-board graphics card base frequency
733
Virtualization (VT-x)
Yes
Intel® Wireless Display (Intel® WiDi)
No
Intel® My WiFi Technology (Intel® MWT)
No
Intel VT-x with Extended Page Tables (EPT)
Yes
Intel® Anti-Theft Technology (Intel® AT)
No
Memory clock speeds supported by processor
1066,1333
Intel® AES New Instructions (Intel® AES-NI)
No
Memory bandwidth supported by processor (max)
21
Maximum internal memory supported by processor
16
Number of displays supported (on-board graphics)
2
Intel® Clear Video HD Technology (Intel® CVT HD)
Yes
Directed I/O virtualization (VT-d)
No
Intel® Hyper Threading Technology (Intel® HT Technology)
Yes
Intel® Clear Video Technology for Mobile Internet Devices (Intel CVT for MID)
No
Country of origin
China
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Product lifecycle

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