Intel OEM: HP MPN: KK693ET

Intel Core Z800 Intel® Xeon® 5000 Sequence X5560 4 GB DDR3-SDRAM Windows 7 Professional Mini Tower Workstation

HP
Released: Oct 22, 2010 16 years ago
Live Price: Awaiting Amazon US Listing
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ECC support
Y
Depth
526.5 mm
Max case temperature (Tcase)
75 °C
Width
203.5 mm
Height
445.1 mm
Weight
21000 g
Bus type
QPI
64-bit support
Y
Stepping
D0
View 100 specifications
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Overview

The HP Z800 Intel® Xeon® 5000 Sequence X5560 4 GB DDR3-SDRAM Windows 7 Professional Mini Tower Workstation features Intel Xeon 5000 processor, 4 cores, up to 3.2 GHz boost and 4 GB of memory. Full verified specifications are listed below.

Compatibility

Socket Socket B (LGA 1366) Memory type DDR3 TDP 95 W
  • Pairs with CPUs using the Socket B (LGA 1366) socket.
  • Requires DDR3 memory — not interchangeable with other generations.
  • Draws up to 95 W — size your cooling and PSU headroom accordingly.

Compatibility data is automatically generated. Always verify critical specs before purchase.

Technical Specifications

Showing 28 key specifications of 100

All values come from this product’s catalog record.
ECC support
Yes
Depth
526.5 mm
Max case temperature (Tcase)
75 °C
Width
203.5 mm
Height
445.1 mm
Weight
21000 g
Bus type
QPI
64-bit support
Yes
Stepping
D0
FSB Parity
No
Idle power states
Yes
Chassis type
Mini Tower
Capacity
500 GB
Memory slots
12x DIMM
Product type
Workstation
Graphics card
No
Drive interface
SATA
Microphone input
Yes
Diskette drive
Yes
Processor code
SLBF4
Capacity
4 GB
Memory channels
Triple-channel
Cache
8 MB
Cores
4
Model
X5560
Bus speed
6.4 GT/s
Display included
No
Intel ARK ID
37109
Show all 100 specifications
Audio system
High Definition Audio
Processor line
Intel Xeon 5000
Processor series
Intel Xeon 5500 series
Socket
Socket B (LGA 1366)
Headphone outputs
1
Threads
8
Intel® Insider™
No
Memory clock
1333 MHz
Optical drive type
DVD Super Multi
Codename
Nehalem EP
Execute Disable (NX)
Yes
Intel® Smart Cache
Yes
Chipset
Intel 5520
Networking features
Gigabit Ethernet (10/100/1000)
Number of QPI links
2
Die size
263 mm²
Clock speed
2.8 GHz
Intel FDI Technology
No
Memory type
DDR3-SDRAM
Cache level
Smart Cache
Process node
45 nm
Processor system type
DP
Serial ports
1
Card reader
Yes
CPU brand
Intel
Processor package size
42.5 x 45
USB 2.0 ports
9
CPU configuration (max)
2
Conflict-free minerals
No
Intel Fast Memory Access
No
Intel Flex Memory Access
No
Number of HDDs installed
1
Intel Enhanced Halt State
Yes
Boost clock
3.2 GHz
CPU operating modes
64-bit
ECC memory support
Yes
Long-term availability
No
Ethernet ports
2
FireWire ports
2
Operating system
Windows 7 Professional
TDP
95 W
Operating temperature
5 - 35
Intel Clear Video Technology
No
Intel Demand Based Switching
Yes
OS architecture
64-bit
Intel Rapid Storage Technology
No
Intel® InTru™ 3D Technology
No
Intel® Turbo Boost Technology
1.0
Number of processors installed
1
CPU multiplier (bus/core ratio)
21
Thermal monitoring
No
Physical Address Extension (PAE)
40
Trusted Execution (TXT)
No
SpeedStep power scaling
Yes
Intel® Quick Sync Video Technology
No
Memory types supported by processor
DDR3-SDRAM
Transistor count
731
Intel Dual Display Capable Technology
No
Virtualization (VT-x)
Yes
Intel® Wireless Display (Intel® WiDi)
No
Intel® My WiFi Technology (Intel® MWT)
No
Intel VT-x with Extended Page Tables (EPT)
Yes
Intel® Anti-Theft Technology (Intel® AT)
No
Memory clock speeds supported by processor
800,1066,1333
Intel® AES New Instructions (Intel® AES-NI)
No
Memory bandwidth supported by processor (max)
32
Maximum internal memory supported by processor
144
Intel® Clear Video HD Technology (Intel® CVT HD)
No
Directed I/O virtualization (VT-d)
Yes
Intel® Hyper Threading Technology (Intel® HT Technology)
Yes
Intel® Clear Video Technology for Mobile Internet Devices (Intel CVT for MID)
No
Country of origin
China
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Sources

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Product lifecycle

Status uncertain

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